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Proceedings Paper

Phase-measuring methods for measurement of three-dimensional shapes in automated inspection of manufactured electronic assemblies
Author(s): Jeremy David Pearson; Francis Lilley; David R. Burton; John T. Atkinson; Shirish P. Kshirsagar; David J. Search; Clifford Allan Hobson
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Paper Abstract

This paper describes research into a noncontact system for the measurement of components and solder on printed circuit boards (PCBs). The objective of the system is the inspection of the PCB to identify faults in the manufacturing process. A fringe pattern is generated on the PCB, using either interferometric methods or projection of a grating, and the image of the fringe pattern is captured and stored on a frame store. The pattern is then processed to reconstruct the 3D shape of the PCB surface from which parameters which relate to PCB integrity can be determined. Results demonstrate the feasibility of the method.

Paper Details

Date Published: 11 March 1994
PDF: 11 pages
Proc. SPIE 2183, Machine Vision Applications in Industrial Inspection II, (11 March 1994); doi: 10.1117/12.171213
Show Author Affiliations
Jeremy David Pearson, Liverpool John Moores Univ. (United Kingdom)
Francis Lilley, Liverpool John Moores Univ. (United Kingdom)
David R. Burton, Liverpool John Moores Univ. (United Kingdom)
John T. Atkinson, Liverpool John Moores Univ. (United Kingdom)
Shirish P. Kshirsagar, Liverpool John Moores Univ. (United Kingdom)
David J. Search, Liverpool John Moores Univ. (United Kingdom)
Clifford Allan Hobson, Liverpool John Moores Univ. (United Kingdom)


Published in SPIE Proceedings Vol. 2183:
Machine Vision Applications in Industrial Inspection II
Benjamin M. Dawson; Stephen S. Wilson; Frederick Y. Wu, Editor(s)

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