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Proceedings Paper

Thermal measurement techniques of IC package boards by means of infrared radiometer
Author(s): Yoshizo Okamoto; Terumi Inagaki; Noriyoshi Tsuyuzaki; Weiqin Chen
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Paper Abstract

This paper concerns thermal analysis of the IC package board. To analyze fundamental mechanisms of fluid flow and heat of the IC board array, the IR radiometer is used to visualize radiation temperature pattern of the IC package surface through a transparent plastic wall. Considering transmission rate of the plastic wall, the measured radiation temperature was transformed into the real temperature as function of the emissivity of the IC surface. Isotherm of the radiation temperature distribution of the front and back side surface of the IC board shows the existence of thermal wake pattern caused by surrounding air flow. Steady state and transient 2D temperature distribution of the IC package, heat transfer rate of the front and back side of the IC board and cooling enhancement effects were measured and analyzed systematically.

Paper Details

Date Published: 21 March 1994
PDF: 10 pages
Proc. SPIE 2245, Thermosense XVI: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (21 March 1994); doi: 10.1117/12.171173
Show Author Affiliations
Yoshizo Okamoto, Ibaraki Univ. (Japan)
Terumi Inagaki, Ibaraki Univ. (Japan)
Noriyoshi Tsuyuzaki, Okumura Yuki Co. Ltd. (Japan)
Weiqin Chen, Okumura Yuki Co. Ltd. (Japan)


Published in SPIE Proceedings Vol. 2245:
Thermosense XVI: An International Conference on Thermal Sensing and Imaging Diagnostic Applications
John R. Snell, Editor(s)

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