Proceedings Paper
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Paper Abstract
This paper describes a feasibility study done to demonstrate `ultra-high' resolution imaging with a triangulation-based 3D laser scanner. General requirements for micron-level 3D inspection applications are discussed, followed by a proposal of a laser triangulation-based system to address these requirements. Some fundamental limits and trade-offs of 3D imaging are reviewed, and methods for overcoming technical challenges are discussed. Finally, images from a prototype scanning system demonstrating sub-micron resolution at rates faster than 1 Mhz are presented.
Paper Details
Date Published: 15 March 1994
PDF: 10 pages
Proc. SPIE 2065, Optics, Illumination, and Image Sensing for Machine Vision VIII, (15 March 1994); doi: 10.1117/12.169371
Published in SPIE Proceedings Vol. 2065:
Optics, Illumination, and Image Sensing for Machine Vision VIII
Donald J. Svetkoff, Editor(s)
PDF: 10 pages
Proc. SPIE 2065, Optics, Illumination, and Image Sensing for Machine Vision VIII, (15 March 1994); doi: 10.1117/12.169371
Show Author Affiliations
Donald J. Svetkoff, Synthetic Vision Systems, Inc. (United States)
Donald B.T. Kilgus, Synthetic Vision Systems, Inc. (United States)
Published in SPIE Proceedings Vol. 2065:
Optics, Illumination, and Image Sensing for Machine Vision VIII
Donald J. Svetkoff, Editor(s)
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