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Proceedings Paper

Ductile grinding of silicon carbide as a production method for reflective optics
Author(s): William K. Kahl
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Paper Abstract

Ductile regime grinding or shear-mode grinding is an enabling technology that is finding application in the optics manufacturing industry. By definition, ductile removal occurs when the scale of machining is conducted below a material-dependent critical dimension or chip size. Much of the interest in ductile grinding resides in manufacturing glass optics, which experience brittle-ductile transition at on the order of magnitude 10 nm. Silicon carbide has a critical dimension that is on the order of 100 - 200 nm, making it a more attractive candidate for the technology. Preliminary results from an on-axis chemical vapor deposited (CVD) SiC sphere (f/14) indicate 317 angstrom surface roughness and 0.96 wave P-V figure were achieved with this manufacturing method. Surface finish, interferometric measured figure and BRDF scatter results are presented from ductile regime grinding of 40 and 75 mm flats of CVD silicon carbide, bare reaction bonded SiC (RBSiC) and uniaxial hot-pressed SiC (HPSiC).

Paper Details

Date Published: 1 February 1994
PDF: 8 pages
Proc. SPIE 1994, Advanced Optical Manufacturing and Testing IV, (1 February 1994); doi: 10.1117/12.167980
Show Author Affiliations
William K. Kahl, Oak Ridge National Lab. (United States)


Published in SPIE Proceedings Vol. 1994:
Advanced Optical Manufacturing and Testing IV
Victor J. Doherty, Editor(s)

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