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Proceedings Paper

Fabrication of perfectly three-dimensional microstructures by UV depth lithography
Author(s): Gunter Engelmann; Oswin Ehrmann; Rudolf Leutenbauer; Heike Schmitz; Herbert Reichl
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Paper Abstract

Repeated conventional UV depth lithography and electroplating allows us to produce microstructures of varying size in the third dimension. The structures are about 50 micrometers high and the bearing clearances are in the micrometers range. A number of alternative processes and applications are reviewed. The status of the UV depth lithography of positive photoresist and the TUB process for electroplating (Au) high depth-to-width aspect ratio microstructures is briefly described. Capacitive micromotors, a capacitive acceleration sensor, and 3D microcoils have been fabricated. These results are discussed and possible future steps and applications are mentioned.

Paper Details

Date Published: 1 February 1994
PDF: 8 pages
Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); doi: 10.1117/12.167571
Show Author Affiliations
Gunter Engelmann, Technische Univ. Berlin (Germany)
Oswin Ehrmann, Technische Univ. Berlin (Germany)
Rudolf Leutenbauer, Technische Univ. Berlin (Germany)
Heike Schmitz, Technische Univ. Berlin (Germany)
Herbert Reichl, Technische Univ. Berlin (Germany)


Published in SPIE Proceedings Vol. 2045:
Laser-Assisted Fabrication of Thin Films and Microstructures
Ian W. Boyd, Editor(s)

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