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Proceedings Paper

High aspect ratio resist structures for optoelectronic (and other) applications
Author(s): Martin C. Peckerar; Milton Rebbert; Ganesh K. Gopalakrishnan
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Paper Abstract

In this paper we discuss methods for fabricating high aspect ratio structures in thick photoresist. Resist thicknesses in excess of 10 microns can be patterned with near-micron features and with near vertical sidewalls using the techniques described herein. Limits of the lithography relating to dimension control and to maximum usable resist thickness are discussed. Applications of the process to optoelectronics and micromachining are described.

Paper Details

Date Published: 1 February 1994
PDF: 8 pages
Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); doi: 10.1117/12.167570
Show Author Affiliations
Martin C. Peckerar, Naval Research Lab. (United States)
Milton Rebbert, Naval Research Lab. (United States)
Ganesh K. Gopalakrishnan, Maryland Advanced Development Lab. (United States)

Published in SPIE Proceedings Vol. 2045:
Laser-Assisted Fabrication of Thin Films and Microstructures
Ian W. Boyd, Editor(s)

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