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Proceedings Paper

Software integration of in-situ spectroscopic ellipsometry
Author(s): Sonny Maung; Steven A. Henck; Walter M. Duncan; Doug Mahlum; Chyi Sheng
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Paper Abstract

In situ sensors are key tools for flexible manufacturing environments where wafers with diverse specifications are processed interspersed through common chambers. This is in contrast to conventional batch processing where pilot wafers, ex situ measurement, and statistical method are employed for process control. In the present work, we discuss integration of in situ spectral ellipsometry (SE) into several processes of a flexible manufacturing environment. In situ SE enables real-time wafer-to-wafer compensation for equipment and process drifts and also equipment prognosis. The capability of the TI SE is discussed together with the implementation issues of solving the inverse problem in real time. A robust endpoint detection algorithm using TI SE is presented. Also addressed are the issues in the integration of the SE with the machine control as well as with the computer integrated manufacturing factory for feedforward and feedback control.

Paper Details

Date Published: 15 February 1994
PDF: 14 pages
Proc. SPIE 2091, Microelectronic Processes, Sensors, and Controls, (15 February 1994); doi: 10.1117/12.167360
Show Author Affiliations
Sonny Maung, Texas Instruments Inc. (United States)
Steven A. Henck, Texas Instruments Inc. (United States)
Walter M. Duncan, Texas Instruments Inc. (United States)
Doug Mahlum, Texas Instruments Inc. (United States)
Chyi Sheng, Texas Instruments Inc. (United States)

Published in SPIE Proceedings Vol. 2091:
Microelectronic Processes, Sensors, and Controls
Kiefer Elliott; James A. Bondur; James A. Bondur; Kiefer Elliott; John R. Hauser; John R. Hauser; Dim-Lee Kwong; Asit K. Ray, Editor(s)

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