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Proceedings Paper

Charge-buildup damage to gate oxide
Author(s): Calvin Gabriel
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Paper Abstract

`Antenna' structures over thick oxide were used to detect charge buildup damage to gate oxide, and gate leakage was measured to characterize the extent of damage. Polycide, metal 1, and metal 3 antennas with both area-intensive and edge-intensive configurations were included. After processing through a full triple-level metal, 135 angstroms gate oxide, 0.6 micrometers CMOS flow, individual 5 micrometers X 1 micrometers transistors (over gate oxide which had been stressed by the charge collected through an attached antenna during wafer fabrication) were measured and considered damaged if a current > 1 nA leaked through the oxide when a 5.5 V stress was applied to the gate during testing.

Paper Details

Date Published: 15 February 1994
PDF: 9 pages
Proc. SPIE 2091, Microelectronic Processes, Sensors, and Controls, (15 February 1994); doi: 10.1117/12.167344
Show Author Affiliations
Calvin Gabriel, VLSI Technology, Inc. (United States)


Published in SPIE Proceedings Vol. 2091:
Microelectronic Processes, Sensors, and Controls
Kiefer Elliott; James A. Bondur; James A. Bondur; Kiefer Elliott; John R. Hauser; John R. Hauser; Dim-Lee Kwong; Asit K. Ray, Editor(s)

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