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Proceedings Paper

Al-Cu alloy etching using in-reactor aluminum chloride formation in static magnetron triode reactive ion etching
Author(s): Masaaki Sato
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Paper Abstract

This paper presents a new Al-Cu alloy etching system that uses aluminum chloride formed in static magnetron triode reactive ion etching (SMTRIE). An overview of SMTRIE is provided, along with a description of the mechanism of copper chloride vaporization with aluminum chloride. Four axisymmetric coils produce radial magnetic flux near and parallel to the etching cathode, and cylindrical magnetic flux parallel to the surrounding second side cathode. This field creates a radially uniform magnetron-type discharge. Etching results demonstrate the excellent uniformity of SMTRIE with low MOS gate damage.

Paper Details

Date Published: 15 February 1994
PDF: 11 pages
Proc. SPIE 2091, Microelectronic Processes, Sensors, and Controls, (15 February 1994); doi: 10.1117/12.167342
Show Author Affiliations
Masaaki Sato, NTT LSI Labs. (Japan)


Published in SPIE Proceedings Vol. 2091:
Microelectronic Processes, Sensors, and Controls
Kiefer Elliott; James A. Bondur; James A. Bondur; Kiefer Elliott; John R. Hauser; John R. Hauser; Dim-Lee Kwong; Asit K. Ray, Editor(s)

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