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Proceedings Paper

Microchannel heat exchangers: a review
Author(s): John S. Goodling
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Paper Abstract

The early work by Tuckerman and Pease on high-performance heat sinks has provoked numerous uses of them as a means of cooling electronic components. This paper is a review of 73 available works by academics and/or researchers who have used the original microchannel heat sink concept or have extended its design or use to turbulent flow, variable channel/fin width ratios, entrance effects, problem generalization, refined optimization, and macrochannel heat exchangers. Various investigators have reported design methodologies, designs, prototypical concepts, comparative and experimental results, and bold innovations on the use of microchannel heat sinks. Several computer codes are identified which perform the calculations needed to describe a particular heat sink: one examines laminar flow devices only, another investigates the effects of a myriad of parameters on the overall thermal resistance of the heat sink and a third offers a design methodology which determines the important dimensions for an optimal heat sink with no restrictions regarding flow type or channel to fin width ratios.

Paper Details

Date Published: 12 November 1993
PDF: 17 pages
Proc. SPIE 1997, High Heat Flux Engineering II, (12 November 1993); doi: 10.1117/12.163830
Show Author Affiliations
John S. Goodling, Auburn Univ. (United States)


Published in SPIE Proceedings Vol. 1997:
High Heat Flux Engineering II
Ali M. Khounsary, Editor(s)

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