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Proceedings Paper

Architectural impact of patterned-overlay multichip module technologies
Author(s): James C. Lyke
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Paper Abstract

The advent of highly advanced multi-chip module (MCM) technologies makes it feasible to consider higher performance computer architectures optimized for a particular packaging approach. In particular, the High Density Interconnect (HDI) technology and related patterned overlay technologies allow for high bandwidth topologies to be constructed which are beyond the reach of many other packaging technologies. Through the use of the recently developed three-dimensional extensions of the HDI process, even more aggressive computer designs can be undertaken. Variations of the physical topologies that can be constructed with the two- and three-dimensional HDI processes provoke new paradigms in future high-performance computer construction.

Paper Details

Date Published: 20 October 1993
PDF: 12 pages
Proc. SPIE 1957, Architecture, Hardware, and Forward-Looking Infrared Issues in Automatic Target Recognition, (20 October 1993); doi: 10.1117/12.161441
Show Author Affiliations
James C. Lyke, Phillips Lab. (United States)


Published in SPIE Proceedings Vol. 1957:
Architecture, Hardware, and Forward-Looking Infrared Issues in Automatic Target Recognition
Lynn E. Garn; Lynda Ledford Graceffo, Editor(s)

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