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Proceedings Paper

Miniature FPA/IDCA: progress report
Author(s): Gregory R. Leonard; J. Brian Toft; Jan Tollefson; Nachman Pundak; D. Admon
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Paper Abstract

Two-dimensional infrared focal plane array detectors in general are characterized by a significantly larger size and thermal mass than the traditional discrete element detectors. Usually, they contain an `on-board' signal processor. The size and thermal mass impact is significant in the radiation shield/cold optics subassembly. In order to achieve miniaturization, low input power and fast cool down time, a combined team of Cincinnati Electronics Corporation, Mason, Ohio and RICOR-Cryogenic and Vacuum Systems, EnHarod (IHUD), Israel are working on the development of a Miniature Integral Cooler/Dewar Assembly-IDCA specially tailored for 2-D FPA type detectors. A progress report, based on accumulated experimental data gathered through the operation of engineering models of this type in a laboratory level and in a system level under various conditions, is presented.

Paper Details

Date Published: 1 November 1993
PDF: 9 pages
Proc. SPIE 2020, Infrared Technology XIX, (1 November 1993); doi: 10.1117/12.160575
Show Author Affiliations
Gregory R. Leonard, Cincinnati Electronics Corp. (United States)
J. Brian Toft, Cincinnati Electronics Corp. (United States)
Jan Tollefson, Cincinnati Electronics Corp. (United States)
Nachman Pundak, RICOR Ltd. (Israel)
D. Admon, RICOR Ltd. (Israel)

Published in SPIE Proceedings Vol. 2020:
Infrared Technology XIX
Bjorn F. Andresen; Freeman D. Shepherd, Editor(s)

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