Share Email Print

Proceedings Paper

Finite-element analysis of adhesive butt joints in fiber optic devices
Author(s): John A. Sultana; Daniel R. O'Brien; Steven E. Forman
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The performance stability of a contacting butt-joint type of fiber attachment method, which is commonly used in the fiber optic industry, is evaluated in this paper. The particular butt joint design in question is a glass fiber bonded to a lithium niobate Mach-Zehnder modulator using UV curing optical adhesive. The joint is susceptible to optical loss levels that can increase with repeated thermal cycles, unless the fiber attachment method is carefully carried out. Difficulties have occurred during the warm portions of thermal cycles and subsequent microscopic analyses of failed devices suggested the presence of adhesive delamination at fiber-to-modulator joints.

Paper Details

Date Published: 27 September 1993
PDF: 11 pages
Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158617
Show Author Affiliations
John A. Sultana, Lincoln Lab./MIT (United States)
Daniel R. O'Brien, Lincoln Lab./MIT (United States)
Steven E. Forman, Lincoln Lab./MIT (United States)

Published in SPIE Proceedings Vol. 1999:
Adhesives Engineering
Eric A. Norland; Kenneth M. Liechti, Editor(s)

© SPIE. Terms of Use
Back to Top