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Proceedings Paper

Mechanisms relating to reducing stress in curing thick sections of UV adhesives
Author(s): Eric A. Norland; Frank S. Martin
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Paper Abstract

Ultraviolet curing adhesives are widely used in optical lamination of precision optical lenses, safety windows, holographic displays, and flat panel displays. In most of these applications they are being used in relatively thin films from 3 microns to 40 mils, because most formulations will only allow uv light to penetrate to a certain depth. If the formulation does cure in thicker sections, the stress due to shrinkage typically becomes a problem. U.V. adhesives have been developed which can be cured in relatively thick sections with minimum stress. In this paper, a number of formulations are compared for variations in stress when cured in thick sections and the conditions and mechanism to minimize stress are characterized.

Paper Details

Date Published: 27 September 1993
PDF: 5 pages
Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158613
Show Author Affiliations
Eric A. Norland, Norland Products Inc. (United States)
Frank S. Martin, Norland Products Inc. (United States)


Published in SPIE Proceedings Vol. 1999:
Adhesives Engineering
Eric A. Norland; Kenneth M. Liechti, Editor(s)

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