Share Email Print
cover

Proceedings Paper

Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure
Author(s): Howard Fein
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Holographic Interferometry techniques have been successfully employed to characterize and test the behavior of structures under stress. These techniques are especially suited to investigating the efficacy of bonds at the interfaces of different materials in complex laminated structures. Complex bonded structures of highly dissimilar materials are often difficult to characterize with radiographic, ultrasonic, or other 'conventional' techniques. Such structures can present great variations in density and extremes in bond strength, as well as tremendous dimensional differences which may foil such non-destructive evaluation. These are ideal requisites, however, for analysis using advanced real-time and multi-exposure holographic methods.

Paper Details

Date Published: 27 September 1993
PDF: 6 pages
Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158612
Show Author Affiliations
Howard Fein, Pressco Technology Inc. (United States)


Published in SPIE Proceedings Vol. 1999:
Adhesives Engineering
Eric A. Norland; Kenneth M. Liechti, Editor(s)

© SPIE. Terms of Use
Back to Top