Share Email Print
cover

Proceedings Paper

Failure analysis of adhesively bonded composite joint: an elasto-plastic approach
Author(s): S. C. Pradhan; N. N. Kishore; N. G. R. Iyengar
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Joints are important load transferring members in large assembled structures. In joining similar and dissimilar materials, the use of adhesives offers many advantages when compared to other conventional methods. Most commonly used adhesives are the polymers, which exhibit nonlinear behavior. Finite element analysis with paired nodes along the crack path is employed to predict the crack initiation and growth leading to failure. The bond strength is predicted by investigating the possibility of propagation of a crack at the interface of adherend and adhesive. Paired nodes are opened in a sequence, modelling the crack growth. The adhesive is treated to be elasto-plastic for its response. Effect of the parameters such as, stacking sequences in composite adherend, crack growth locations, bond length, bond thicknesses and adhesive stiffnesses on the failure load is studied. The growth of plastic zone as the crack propagates is also examined. On the basis of this study optimal geometrical and material parameters are suggested. The elasto-plastic analysis predicts higher failure loads as compared to linear elastic analysis. The computed bond strength assuming elastic behavior for the adhesive shows satisfactory comparison with experimental results.

Paper Details

Date Published: 27 September 1993
PDF: 10 pages
Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158611
Show Author Affiliations
S. C. Pradhan, Indian Institute of Technology, Kanpur (India)
N. N. Kishore, Indian Institute of Technology, Kanpur (India)
N. G. R. Iyengar, Indian Institute of Technology, Kanpur (India)


Published in SPIE Proceedings Vol. 1999:
Adhesives Engineering
Eric A. Norland; Kenneth M. Liechti, Editor(s)

© SPIE. Terms of Use
Back to Top