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Proceedings Paper

Nondestructive testing of bonded structures with Reverse Geometry X-ray imaging
Author(s): Thomas Milton Albert
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Paper Abstract

Die attach voids and bonding defects, including insufficient and excessive adhesive, as well as porosity (resin starvation) are imaged with Reverse Geometry X-rayTM technology. HIgh contrast sensitivity (0.2%) is obtained in a large area, real-time/near real-time system. X-rays originate in the source, which is modelled upon the cathode ray tube. A computer synchronizes the beam sweep, the detector readout rate, and the monitor sweep. Digital output from the detector unit allows the system to display first generation images, without recourse to an image intensifier or vidicon. A small scintillating crystal detector is placed from 7 centimeters to 3 meters from the source/object.

Paper Details

Date Published: 27 September 1993
PDF: 11 pages
Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158603
Show Author Affiliations
Thomas Milton Albert, Digiray Corp. (United States)

Published in SPIE Proceedings Vol. 1999:
Adhesives Engineering
Eric A. Norland; Kenneth M. Liechti, Editor(s)

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