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Proceedings Paper

Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives
Author(s): Devin E. Mix; Avram Bar-Cohen
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Paper Abstract

The use of loaded epoxy adhesives in the microelectronics industry is widespread. Integrated circuit (IC) chips are often adhesively bonded to die-pads, substrates, leadframes, and/or heatspreaders. In addition to silicon, a variety of adherends including IC passivation coatings (such as polyimide), copper and copper alloys (plated with precious metals and non-plated), aluminum, and ceramics (such as alumina (Al2O3)) are encountered in situations such as these. The adhesion strength as well as the mechanical properties of the adhesives used in these configurations are unfortunately not well known. In order to obtain an estimate of the values of the parameters that are of interest it is necessary to experimentally investigate the adhesives in the configuration under consideration. This was done for a number of commercially available loaded epoxy adhesives. A full factorial experimental study was conducted, using double lap shear test specimens (DLSTSs), in order to determine the effect of moisture and temperature on the adhesion strength of these adhesives. An Instron mechanical test system was used to generate force-displacement (F-d) curves for each of the adhesives that were studied. The adhesives that were examined consisted of both 'low stress' and high strength materials and they were obtained from four different vendors. The experimental results were also used in conjunction with a Finite Element (FE) model of the DLSTS in order to determine the non-linear Young's moduli of the adhesives as a function of strain, moisture, and temperature.

Paper Details

Date Published: 27 September 1993
PDF: 17 pages
Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158598
Show Author Affiliations
Devin E. Mix, Univ. of Minnesota/Twin Cities (United States)
Avram Bar-Cohen, Univ. of Minnesota/Twin Cities (United States)


Published in SPIE Proceedings Vol. 1999:
Adhesives Engineering
Eric A. Norland; Kenneth M. Liechti, Editor(s)

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