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Proceedings Paper

Using the analysis of stress waves to build research for experimentation on ultrasonic film measurement
Author(s): Shi-Shing Chang; John H. Wu
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Paper Abstract

After the 2th world war, although the application of ultrasonic wave in industries is becoming more and more popular. But due to the restriction of the precise equivelent , experimental method and the support of the basic theoremsetc. Ultrasonic wave is not applied in precise measurement. Nowadays due to many conditions - the improvement in the production technic, the precise of the equivelent, causes to increase the application of ultrasonic wave. But it's still limited due to the lack of measurement and analysis theorem. In this paper, first we caculate translation of the stress wave (elastic wave) in material for the free surface of material by a normal impulse load. as the theorem analysis base in real application. It is applied to an experiment of film measurement. We can find the partical motion in material and the arriving time of wave front. Then we can estimate the thickness of layers and can prove the actual condition with the result of experiment. This resarch is not only in the theoretical investigation but also in setting overall the measurement system, and excutes the following three experiments: the thickness measurement of two layers, the thickness measurement of film material. the thickness measurement of air propagation. About the data processing, we relied on the frequency analysis to evalute the time difference of two overlapped ultrasonic wave signal. in the meanwhile. we also designed several computer programs to assist the sonic wave identification and signal analysis.

Paper Details

Date Published: 22 September 1993
PDF: 19 pages
Proc. SPIE 2101, Measurement Technology and Intelligent Instruments, (22 September 1993); doi: 10.1117/12.156427
Show Author Affiliations
Shi-Shing Chang, National Central Univ. (Taiwan)
John H. Wu, National Central Univ. (Taiwan)


Published in SPIE Proceedings Vol. 2101:
Measurement Technology and Intelligent Instruments

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