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Proceedings Paper

Delay-time stable chemically amplified deep-UV resist
Author(s): Klaus Juergen Przybilla; Yoshiaki Kinoshita; Takanori Kudo; Seiya Masuda; Hiroshi Okazaki; Munirathna Padmanaban; Georg Pawlowski; Horst Roeschert; Walter Spiess; Natusmi Suehiro
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Paper Abstract

This paper describes a newly developed acetal-based positive tone deep UV photoresist called DX 46. The material consists of a 4-hydroxystyrene/4-hydroxy-3-methylstyrene copolymer, a polymeric dissolution inhibitor, and a bleachable diazo-photoactive compound. Each of the three compounds is specially designed to fit to each other for high performance sub-halfmicron resolution. The main idea is the use of a poly-N,O-acetal for dissolution inhibition which undergoes efficient acid catalyzed bond cleavage that produces strong dissolution promoting fragments in the exposed area. We determined the activation energy for hydrolysis reaction of our polyacetal to be 10 Kcal/mol. The radiation induced acid catalyzed hydrolysis reaction starts right after exposure and is accomplished by a mild post exposure bake at low temperature. This resist system is not sensitive to airborne contamination and no charcoal filtered air or diffusion barrier top coats are necessary for T-top free performance.

Paper Details

Date Published: 15 September 1993
PDF: 16 pages
Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); doi: 10.1117/12.154803
Show Author Affiliations
Klaus Juergen Przybilla, Hoechst Japan Ltd. (Japan)
Yoshiaki Kinoshita, Hoechst Japan Ltd. (Japan)
Takanori Kudo, Hoechst Japan Ltd. (Japan)
Seiya Masuda, Hoechst Japan Ltd. (Japan)
Hiroshi Okazaki, Hoechst Japan Ltd. (Japan)
Munirathna Padmanaban, Hoechst Japan Ltd. (Japan)
Georg Pawlowski, Hoechst AG (Germany)
Horst Roeschert, Hoechst AG (Germany)
Walter Spiess, Hoechst AG (Germany)
Natusmi Suehiro, Hoechst Japan Ltd. (Japan)

Published in SPIE Proceedings Vol. 1925:
Advances in Resist Technology and Processing X
William D. Hinsberg, Editor(s)

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