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Proceedings Paper

Thermal properties of state of the art novolak-diazonaphtoquinone systems: differences between bulk and film properties
Author(s): Patrick Jean Paniez; Jean-Paul E. Chollet; Michel J. Pons
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Paper Abstract

As demonstrated by both thermal analysis (DSC) and thermal flow experiments, the latest resists for advanced i-line lithography exhibit improved thermal properties. Emphasis is placed upon experimental details to obtain reliable and meaningful data. In addition to the results of these experiments, the high glass transition temperatures (Tg) measured, equal or superior to the recommended soft-bake conditions, raise new questions concerning the formation and properties of the resist film. The Tg of the film is shown to be different from that of the bulk material and to depend on the bake conditions. The DSC results are confirmed by thermal flow experiments and a good correlation is obtained between the two methods. The consequences induced by the use of high Tg materials on other steps in the lithographic process, namely standing wave reduction and plasma durability, are also discussed.

Paper Details

Date Published: 15 September 1993
PDF: 12 pages
Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); doi: 10.1117/12.154797
Show Author Affiliations
Patrick Jean Paniez, France Telecom/CNET-CNS (France)
Jean-Paul E. Chollet, France Telecom/CNET-CNS (France)
Michel J. Pons, France Telecom/CNET-CNS (France)


Published in SPIE Proceedings Vol. 1925:
Advances in Resist Technology and Processing X
William D. Hinsberg, Editor(s)

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