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Proceedings Paper

Influence of residual casting solvent on the dissolution behavior of diazonaphthoquinone resists
Author(s): Veena Rao; William D. Hinsberg; Curtis W. Frank; Roger Fabian W. Pease
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Paper Abstract

Residual casting solvent present in resist films can have a profound effect on their dissolution behavior. We have used a radiolabeling technique to make quantitative measurements of solvent remaining in spin cast films after they have undergone different baking protocols. Films of poly (3-methyl-4-hydroxystyrene) were found to contain a significant fraction of propylene glycol methyl ether acetate (as much as 50% by weight) depending on the baking conditions. Films that were 1000 angstroms thick contained a higher percentage of residual solvent than films that were 1 micrometers . The solvent concentration in films containing a mixture of polymer and photoactive compound was a maximum for films containing 5 wt% PAC.

Paper Details

Date Published: 15 September 1993
PDF: 14 pages
Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); doi: 10.1117/12.154789
Show Author Affiliations
Veena Rao, Stanford Univ. (United States)
William D. Hinsberg, IBM Almaden Research Ctr. (United States)
Curtis W. Frank, Stanford Univ. (United States)
Roger Fabian W. Pease, Stanford Univ. (United States)


Published in SPIE Proceedings Vol. 1925:
Advances in Resist Technology and Processing X
William D. Hinsberg, Editor(s)

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