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Proceedings Paper

Model of the process of dissolution and swelling of thin polymethylmethacrylate films
Author(s): Vladimir N. Genkin; M. Yu. Myl'nikov
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Paper Abstract

In the fabrication of integrated circuits (IC) the solubility dependence of a polymer on its macromolecular length is used. The development process is multistage and involves series thicknesses just as in photo and plasma etching. In lithography this process is considered surface and its rate depends on average molecular mass. We expect that the dissolution rate is a time function and that it depends not only on M, but also on the mass-molecular distribution. We propose that the swelling factor is important too. The aim of this work is to construct a model of swelling and dissolution processes and to estimate the positive resists contrast dependence on the polymerization degree and solvent thermodynamic quality.

Paper Details

Date Published: 15 September 1993
PDF: 7 pages
Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); doi: 10.1117/12.154786
Show Author Affiliations
Vladimir N. Genkin, Institute of Applied Physics (Russia)
M. Yu. Myl'nikov, Institute of Applied Physics (Russia)


Published in SPIE Proceedings Vol. 1925:
Advances in Resist Technology and Processing X
William D. Hinsberg, Editor(s)

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