Share Email Print

Proceedings Paper

Effect of ultraviolet curing temperature on the state of stress and mechanical properties of photoresists
Author(s): Jeffrey F. Taylor; Quinn K. Tong; Richard J. Farris
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Ultraviolet curing, typical during processing of photoresist coatings, often results in residual stress. This stress is critical since it is the driving force for failure in a coating. Increasing the stress usually corresponds to a decrease in the mechanical performance. The source of residual stress was illustrated to be a result of thermal expansion mismatch between the substrate and the coating during the cooling stage following UV cure. The objective of this investigation was to reduce the residual stress by decreasing the ultraviolet curing temperature. A photoresist coating was UV cured at 3 different temperatures and the state of stress and mechanical properties were evaluated. A reduction in the state of stress of the photoresist coating was observed. Using incremental elasticity, this reduction in stress was determined to be primarily a result of decreasing the thermal stresses associated with cooling. When the cure temperature was close to the glass transition temperature, a decrease in the ultimate strength and modulus were observed, which was attributed to a decrease in the efficiency of the crosslinking reaction present during UV cure.

Paper Details

Date Published: 15 September 1993
PDF: 11 pages
Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); doi: 10.1117/12.154780
Show Author Affiliations
Jeffrey F. Taylor, Univ. of Massachusetts/Amherst (United States)
Quinn K. Tong, Univ. of Massachusetts/Amherst (United States)
Richard J. Farris, Univ. of Massachusetts/Amherst (United States)

Published in SPIE Proceedings Vol. 1925:
Advances in Resist Technology and Processing X
William D. Hinsberg, Editor(s)

© SPIE. Terms of Use
Back to Top