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Proceedings Paper

New chemistry in the design of chemically amplified positive resists
Author(s): Robert D. Allen; Quan P. Ly; Gregory M. Wallraff; Carl E. Larson; William D. Hinsberg; Will Conley; Karl Paul Muller
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Paper Abstract

The quest for high performance positive deep-UV resist is a significant challenge. In this paper we discuss a new approach to chemically amplified positive resists involving the use of a new and versatile class of polymeric dissolution inhibitors. Methacrylate terpolymers originally designed as chemically amplified positive resists for printed circuit board technology have been found to form stable, one-phase mixtures with a variety of phenolic resins. These new dissolution inhibitors based on MMA-TBMA-MAA terpolymers have unusual and useful properties, including excellent optical transmission at 248 nm, high glass transition temperatures, and dissolution inhibition/promotion power which can be tailored to accommodate the dissolution properties of the particular phenolic resin being used.

Paper Details

Date Published: 15 September 1993
PDF: 11 pages
Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); doi: 10.1117/12.154758
Show Author Affiliations
Robert D. Allen, IBM Almaden Research Ctr. (United States)
Quan P. Ly, IBM Almaden Research Ctr. (United States)
Gregory M. Wallraff, IBM Almaden Research Ctr. (United States)
Carl E. Larson, IBM Almaden Research Ctr. (United States)
William D. Hinsberg, IBM Almaden Research Ctr. (United States)
Will Conley, IBM East Fishkill (United States)
Karl Paul Muller, IBM East Fishkill (United States)

Published in SPIE Proceedings Vol. 1925:
Advances in Resist Technology and Processing X
William D. Hinsberg, Editor(s)

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