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Proceedings Paper

Cost/benefit analysis of mix-and-match lithography for production of half-micron devices
Author(s): John G. Maltabes; Mark C. Hakey; Alan L. Levine
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Paper Abstract

This paper describes a high-leverage cost-reduction methodology -- advanced mix-and-match lithography. Quantifying the areas of cost savings and cost of ownership is essential in determining the optimum mix-and-match approach. Cost of ownership, using operating data coupled with quantitative models, is analyzed for a half-micron 200 mm fabrication line producing 16 Mbit DRAMs. Utilizing advanced lithography clusters to process the critical levels and cost-effective high-productivity cluster systems for the non-critical levels has resulted in a net production cost savings in excess of 30%. Data comparisons are made between process enhancements and tool types. Areas of cost savings are identified individually and ranked. Further, tradeoffs in learning, cycle time, and technology extendibility are also considered. The cost/benefit analysis demonstrates that mix-and-match lithography is a highly effective method for reducing lithography costs. This paper also discusses the increasing importance of cost modeling to improve competitiveness.

Paper Details

Date Published: 8 August 1993
PDF: 13 pages
Proc. SPIE 1927, Optical/Laser Microlithography, (8 August 1993); doi: 10.1117/12.150478
Show Author Affiliations
John G. Maltabes, IBM Corp. (United States)
Mark C. Hakey, IBM Corp. (United States)
Alan L. Levine, Ultratech Stepper Corp. (United States)

Published in SPIE Proceedings Vol. 1927:
Optical/Laser Microlithography
John D. Cuthbert, Editor(s)

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