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Proceedings Paper

Performance of a 0.5 NA broadband DUV step-and-scan system
Author(s): Mark William Barrick; Doug Bommarito; Karey L. Holland; Katherine C. Norris; Bob Patterson; Yumiko Takamori; Joseph C. Vigil; Timothy J. Wiltshire
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Paper Abstract

The Micrascan II is a 0.50 NA DUV, broadband illumination (245 nm to 252 nm) step-and- scan exposure system manufactured by Silicon Valley Group Lithography Systems, Inc. (SVGL) of Wilton, Connecticut. The tool has been designed to provide 350 nm resolution and 90 nm overlay (mean + 3 sigma) in a semiconductor manufacturing environment. The system utilizes a reticle-limited field size of 22.0 X 32.5 mm. Lithographic and system performance testing of pre-production and production versions of the Micrascan II have been performed. Data from the source acceptance testing of the preproduction tool, as well as product level overlay results, are presented. The production tool acceptance test data are also presented along with results of the first SEMATECH marathon cluster test simulating a manufacturing environment. The production tool is integrated with an SVG 90 series track providing all pre-exposure and post-exposure wafer processing. All work reported has been accomplished using 200 mm wafer substrates.

Paper Details

Date Published: 8 August 1993
PDF: 13 pages
Proc. SPIE 1927, Optical/Laser Microlithography, (8 August 1993); doi: 10.1117/12.150455
Show Author Affiliations
Mark William Barrick, SEMATECH (United States)
Doug Bommarito, SEMATECH (United States)
Karey L. Holland, SEMATECH (United States)
Katherine C. Norris, SEMATECH (United States)
Bob Patterson, SEMATECH (United States)
Yumiko Takamori, SEMATECH (United States)
Joseph C. Vigil, SEMATECH (United States)
Timothy J. Wiltshire, SEMATECH (United States)


Published in SPIE Proceedings Vol. 1927:
Optical/Laser Microlithography
John D. Cuthbert, Editor(s)

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