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Proceedings Paper

New feature extraction technique for detection of defects in microlithography patterns
Author(s): Damayanti C. Gharpure; Sunil K. David
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Paper Abstract

This paper presents a new feature extraction technique named the Bending Point Counting Method (BPCM) for detection of defects in microlithography patterns. Digitization leads to breaking up of continuous contours into line segments and adjoining bending points. The defects are detected by counting the number of bending points in a detector window having dimensions smaller than the minimum linewidth of the pattern. Due to applications of image processing techniques, the algorithm is able to cope with the image distortions and inaccuracies arising due to reproducibility of automatic setting of the inspection system. The paper deals with the principle and mathematical formulation of the algorithm. The experiments carried out to test the validity as well as versatility of the algorithm are discussed.

Paper Details

Date Published: 4 August 1993
PDF: 10 pages
Proc. SPIE 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (4 August 1993); doi: 10.1117/12.149004
Show Author Affiliations
Damayanti C. Gharpure, Univ. of Poona (India)
Sunil K. David, Univ. of Poona (India)


Published in SPIE Proceedings Vol. 1926:
Integrated Circuit Metrology, Inspection, and Process Control VII
Michael T. Postek, Editor(s)

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