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Proceedings Paper

Digital image processing techniques for patterned-wafer inspection
Author(s): Babak H. Khalaj; Hamid K. Aghajan; Thomas Kailath
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Paper Abstract

A new self-reference signal processing technique is proposed for detecting the location of any nonregularities and defects in a periodic two-dimensional signal or image. Using high- resolution spectral estimation algorithms, the proposed technique first extracts the period and structure of repeated patterns from the image to sub-pixel resolution in both directions, and then produces a defect-free reference image for making comparison with the actual image. Since the technique acquires all its needed information from a single image, on the contrary to the existing methods, there is no need for a database image, a scaling procedure, or any a- priori knowledge about the repetition period of the pattern. Results of applying the proposed technique to real images from microlithography are presented.

Paper Details

Date Published: 4 August 1993
PDF: 9 pages
Proc. SPIE 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (4 August 1993); doi: 10.1117/12.148982
Show Author Affiliations
Babak H. Khalaj, Stanford Univ. (United States)
Hamid K. Aghajan, Stanford Univ. (United States)
Thomas Kailath, Stanford Univ. (United States)


Published in SPIE Proceedings Vol. 1926:
Integrated Circuit Metrology, Inspection, and Process Control VII
Michael T. Postek, Editor(s)

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