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Proceedings Paper

Conformal acoustic waveguide sensor development
Author(s): Jeffrey N. Schoess; J. David Zook
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Paper Abstract

This paper describes the detailed design of an acoustic emission-based micromachined sensor for smart structures applications to assess in-flight structural integrity. This unique sensor approach combines silicon sensor micromachining, conformal optical waveguide technology, and high-speed optical interconnects to measure acoustic emission event data related to structural failure. A micron-level dual-element micromachined cantilever beam architecture design is described which incorporates conformal on-chip polyimide optical waveguide interconnects to optically sense structural integrity acoustic parameters and route optical power to the sensor assembly. High-speed optical interconnects are used to transfer sensor data to avionic interfaces for debrief and detailed analysis. A detailed design of the optical waveguide sensor design and the significant payoffs and benefits of these sensors are discussed.

Paper Details

Date Published: 12 July 1993
PDF: 7 pages
Proc. SPIE 1918, Smart Structures and Materials 1993: Smart Sensing, Processing, and Instrumentation, (12 July 1993); doi: 10.1117/12.148010
Show Author Affiliations
Jeffrey N. Schoess, Honeywell Systems and Research Ctr. (United States)
J. David Zook, Honeywell Sensor and System Development Ctr. (United States)


Published in SPIE Proceedings Vol. 1918:
Smart Structures and Materials 1993: Smart Sensing, Processing, and Instrumentation
Richard O. Claus, Editor(s)

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