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Proceedings Paper

Si-based laser subassembly for telecommunications
Author(s): W. Michael MacDonald; R. E. Fanucci; Greg E. Blonder
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Paper Abstract

Silicon is used as a packaging medium to integrate a laser, lenses, and a back facet monitor into a compact sub-assembly suitable for low-cost laser packages. The sub-assembly consists of separate laser and detector/optics submounts made of silicon. Only a single axis alignment is required during assembly to align the lenses (300 micrometers diameter sapphire spheres) with the laser active area. In a single lens configuration, the integrated sub-assembly had 25% coupling efficiency into single-mode fiber compared to 30% maximum coupling efficiency achieved on the optical bench. Coupling efficiencies of the integrated sub-assembly to 50 micrometers multi-mode fiber greater than 70% were achieved. The effective numerical aperture of the back facet monitor in the sub-assembly was greater than 0.7.

Paper Details

Date Published: 24 June 1993
PDF: 6 pages
Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); doi: 10.1117/12.147599
Show Author Affiliations
W. Michael MacDonald, AT&T Bell Labs. (United States)
R. E. Fanucci, AT&T Bell Labs. (United States)
Greg E. Blonder, AT&T Bell Labs. (United States)


Published in SPIE Proceedings Vol. 1851:
Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices
Henryk Temkin, Editor(s)

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