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Proceedings Paper

Micro-optic and microelectronic integrated packaging of vertical-cavity lasers
Author(s): Greg R. Olbright; Jack L. Jewell; Robert P. Bryan; Winston S. Fu
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Paper Abstract

The applications for optoelectronic integrated circuits demand high performance optoelectronic devices or smart pixels. The stringent requirements on these smart pixels require that packaging technology be developed concurrently to the development of the optoelectronic components. We discuss the packaging requirements of smart pixels based on vertical-cavity microlasers. We present a novel microlens/macrolens combination which allows high power densities to be focused to a diffraction-limited spot using present VCSEL technology. Finally, we discuss the applications for microlaser-based spatial light source arrays.

Paper Details

Date Published: 24 June 1993
PDF: 9 pages
Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); doi: 10.1117/12.147590
Show Author Affiliations
Greg R. Olbright, Photonics Research, Inc. (United States)
Jack L. Jewell, Photonics Research, Inc. (United States)
Robert P. Bryan, Photonics Research, Inc. (United States)
Winston S. Fu, Photonics Research, Inc. (United States)

Published in SPIE Proceedings Vol. 1851:
Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices
Henryk Temkin, Editor(s)

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