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Proceedings Paper

Packaging of optical interconnect arrays for optical signal processing and computing
Author(s): Michael Kevin Kilcoyne; Jeff W. Scott; John J. Plombon
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Paper Abstract

There are many requirements for computer interconnects and local loop telecommunications for parallel fiber optic data channels. There have recently been many packaging approaches where a few channels have been cleverly packaged, using self-aligned approaches with silicon photolithographically etched rectangular or V-groove channels to achieve accurate alignment. Practical economical packaging of arrays must be developed, using conventional electronic packages for the interfacing optoelectronic arrays to fiber ribbon cables. In this way, optoelectronic arrays may be introduced which are compatible with conventional electronic packaging, and therefore readily acceptable to present system integrator and manufacturers. Depending on the application, single mode or multi-mode interconnects may be required. This paper proposes approaches to achieve both single mode and multi-mode array packaging which may be interfaced directly to existing electronic systems.

Paper Details

Date Published: 24 June 1993
PDF: 9 pages
Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); doi: 10.1117/12.147588
Show Author Affiliations
Michael Kevin Kilcoyne, Optical Concepts, Inc. (United States)
Jeff W. Scott, Optical Concepts, Inc. (United States)
John J. Plombon, Optical Concepts, Inc. (United States)

Published in SPIE Proceedings Vol. 1851:
Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices
Henryk Temkin, Editor(s)

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