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Proceedings Paper

Chip-to-chip interconnects using poled polymer integrated optic transmitter networks
Author(s): Timothy E. Van Eck; Dexter G. Girton; John Francis Valley; Susan P. Ermer; Anthony J. Ticknor; George F. Lipscomb; Richard S. Lytel
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Paper Abstract

An approach to optical interconnect networks at the module level is presented that addresses the requirements imposed by electronic system manufacturing, such as thermal stability, low cost, and compatibility with standard electronic design, fabrication, and assembly processes. Research is presented on poled polyimide electro-optic materials with extended thermal stability, poled polyimide integrated optic switches acting as transmitters, and a demonstration of a CMOS-compatible optical interconnect.

Paper Details

Date Published: 1 July 1993
PDF: 9 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147114
Show Author Affiliations
Timothy E. Van Eck, Lockheed Palo Alto Research Lab. (United States)
Dexter G. Girton, Lockheed Palo Alto Research Lab. (United States)
John Francis Valley, Lockheed Palo Alto Research Lab. (United States)
Susan P. Ermer, Lockheed Palo Alto Research Lab. (United States)
Anthony J. Ticknor, Lockheed Palo Alto Research Lab. (United States)
George F. Lipscomb, Lockheed Palo Alto Research Lab. (United States)
Richard S. Lytel, Lockheed Palo Alto Research Lab. (United States)


Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)

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