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Proceedings Paper

Multi-fiber/chip coupling and optoelectronic integrated circuit packaging based on flip-chip bonding techniques
Author(s): Rolf Weber; F. Fidorra; Michael Hamacher; Helmut Heidrich; G. Jacumeit
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Paper Abstract

For the packaging of integrated InP devices we present two approaches, which rely on a passive fiber alignment. In one case the fibers are hold in V-grooves etched directly into the InP, alternatively, V-grooves are etched into Si and the InP chip is assembled by a self- aligning flip chip process.

Paper Details

Date Published: 1 July 1993
PDF: 4 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147089
Show Author Affiliations
Rolf Weber, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
F. Fidorra, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
Michael Hamacher, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
Helmut Heidrich, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
G. Jacumeit, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)


Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)

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