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Proceedings Paper

Prototype optically interconnected multichip module based on computer-generated hologram technology
Author(s): James E. Morris; Michael R. Feldman; W. Hudson Welch; Mouna Nakkar; Hedong Yang; John E. Childers; M. Yasin Akhtar Raja; Iwona Turlik; Gretchen M. Adema; Paul A. Magill; Ed Yung
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Paper Abstract

The development of an optical interconnected multichip module (MCM) is underway at UNC- Charlotte. The approach is to use optical interconnects within a digital multichip module for connections that are longer than a certain length (break even line length). For these connections the optical link dissipates less power than the corresponding electrical link. One of the main goals of this project is to develop a technology for optical interconnects that can be implemented with minimal modification to current devices. We are currently in the process of developing a series of MCM systems. System 1 will be a testbed that enables testing of hologram encoding techniques, alignment tolerances, optical link efficiency, and thermal properties. System 2 will use the knowledge gained in the development of system 1 to build a small functional system to demonstrate the technology.

Paper Details

Date Published: 1 July 1993
PDF: 6 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147078
Show Author Affiliations
James E. Morris, Univ. of North Carolina/Charlotte (United States)
Michael R. Feldman, Univ. of North Carolina/Charlotte (United States)
W. Hudson Welch, Univ. of North Carolina/Charlotte (United States)
Mouna Nakkar, Univ. of North Carolina/Charlotte (United States)
Hedong Yang, Univ. of North Carolina/Charlotte (United States)
John E. Childers, Univ. of North Carolina/Charlotte (United States)
M. Yasin Akhtar Raja, Univ. of North Carolina/Charlotte (United States)
Iwona Turlik, MCNC Center for Microelectronic Research (United States)
Gretchen M. Adema, MCNC Center for Microelectronic Research (United States)
Paul A. Magill, MCNC Center for Microelectronic Research (United States)
Ed Yung, MCNC Center for Microelectronic Research (United States)


Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)

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