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Proceedings Paper

Thermally induced stresses and electromigration failure
Author(s): Larisa Kisselgof; S. P. Baranowski; Mike C. Broomfield; T. Spooner; L. Elliott; L. Brooke; James R. Lloyd
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Paper Abstract

Attempts to improve the reliability of narrow passivated Al/Cu conductors as defined by the performance in an accelerated electromigration test are reviewed. The results are explained in terms of the effect of thermally induced stress and stress voiding on electromigration lifetime. Other processing variations which produced small or inconsequential changes are also discussed. In addition, it was observed that electromigration performance in samples susceptible to stress voiding was degraded as a function of storage time at room temperature.

Paper Details

Date Published: 21 May 1993
PDF: 10 pages
Proc. SPIE 1805, Submicrometer Metallization: Challenges, Opportunities, and Limitations, (21 May 1993); doi: 10.1117/12.145478
Show Author Affiliations
Larisa Kisselgof, Digital Equipment Corp. (United States)
S. P. Baranowski, Digital Equipment Corp. (United States)
Mike C. Broomfield, Digital Equipment Corp. (United States)
T. Spooner, Digital Equipment Corp. (United States)
L. Elliott, Digital Equipment Corp. (United States)
L. Brooke, Digital Equipment Corp. (United States)
James R. Lloyd, Digital Equipment Corp. (United States)

Published in SPIE Proceedings Vol. 1805:
Submicrometer Metallization: Challenges, Opportunities, and Limitations
Thomas Kwok; Takamaro Kikkawa; Krishna Shenai, Editor(s)

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