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Proceedings Paper

Collimated sputtering of titanium liner films to control resistance of high-aspect-ratio contacts
Author(s): Thomas L. McDevitt; Scott Pennington; D. Cronin; Tom J. Licata; D. Strippe; James G. Ryan
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Paper Details

Date Published: 21 May 1993
PDF: 1 pages
Proc. SPIE 1805, Submicrometer Metallization: Challenges, Opportunities, and Limitations, (21 May 1993); doi: 10.1117/12.145465
Show Author Affiliations
Thomas L. McDevitt, IBM Essex Junction (United States)
Scott Pennington, IBM Essex Junction (United States)
D. Cronin, IBM Essex Junction (United States)
Tom J. Licata, IBM Essex Junction (United States)
D. Strippe, IBM Essex Junction (United States)
James G. Ryan, IBM Essex Junction (United States)


Published in SPIE Proceedings Vol. 1805:
Submicrometer Metallization: Challenges, Opportunities, and Limitations
Thomas Kwok; Takamaro Kikkawa; Krishna Shenai, Editor(s)

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