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Proceedings Paper

Amorphous metallic alloys: a new advance in thin-film diffusion barriers for copper metallization
Author(s): Elizabeth A. Kolawa; Jason S. Reid; Jen Sue Chen
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Paper Details

Date Published: 21 May 1993
PDF: 7 pages
Proc. SPIE 1805, Submicrometer Metallization: Challenges, Opportunities, and Limitations, (21 May 1993); doi: 10.1117/12.145460
Show Author Affiliations
Elizabeth A. Kolawa, California Institute of Technology (United States)
Jason S. Reid, California Institute of Technology (United States)
Jen Sue Chen, California Institute of Technology (United States)


Published in SPIE Proceedings Vol. 1805:
Submicrometer Metallization: Challenges, Opportunities, and Limitations
Thomas Kwok; Takamaro Kikkawa; Krishna Shenai, Editor(s)

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