Share Email Print

Proceedings Paper

Micron and submicron interconnect modeling
Author(s): Vijai K. Tripathi
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The techniques to study signal delay distortion and crosstalk in high density VLSI/ULSI micron and submicron interconnects are reviewed. These include numerical techniques based on the method of characteristics and the transform based techniques as well as frequency and time domain measurement techniques. The limitations of the classical modeling and measurement techniques in the submicron metallization regime are examined.

Paper Details

Date Published: 21 May 1993
PDF: 1 pages
Proc. SPIE 1805, Submicrometer Metallization: Challenges, Opportunities, and Limitations, (21 May 1993); doi: 10.1117/12.145456
Show Author Affiliations
Vijai K. Tripathi, Oregon State Univ. (United States)

Published in SPIE Proceedings Vol. 1805:
Submicrometer Metallization: Challenges, Opportunities, and Limitations
Thomas Kwok; Takamaro Kikkawa; Krishna Shenai, Editor(s)

© SPIE. Terms of Use
Back to Top