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Proceedings Paper

Interpretation of current-induced noise for detection of ULSI/VLSI interconnection reliability problems
Author(s): James G. Cottle
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Paper Abstract

This paper summarizes several different types of current induced (excess) noise time domain waveforms and the power spectra behavior associated with specific ULSI/VLSI interconnection problems. Importance of maintaining waveform stationarity when using 1/f2 noise to detect electromigration is illustrated. In addition, non-stationary waveforms, associated with thin films with high degrees of stress are reported. A discussion of large magnitude 1/f spectra associated with the presence of film voids, poor step coverage and/or wire bonding problems is presented.

Paper Details

Date Published: 21 May 1993
PDF: 11 pages
Proc. SPIE 1805, Submicrometer Metallization: Challenges, Opportunities, and Limitations, (21 May 1993); doi: 10.1117/12.145452
Show Author Affiliations
James G. Cottle, Univ. of South Florida (United States)


Published in SPIE Proceedings Vol. 1805:
Submicrometer Metallization: Challenges, Opportunities, and Limitations
Thomas Kwok; Takamaro Kikkawa; Krishna Shenai, Editor(s)

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