Share Email Print
cover

Proceedings Paper

Effect of strain on diffusion kinetics and activation energy for Al grain-boundary diffusion: a computer simulation
Author(s): Thomas Kwok
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The effect of strain on grain-boundary diffusion has been evaluated by molecular dynamics simulations. The system studied was a tilt boundary in a fcc bicrystal model with interatomic potential calculated by the Embedded Atom Method. The results confirm the dominance of vacancy jump mechanism in grain-boundary diffusion even with up to 1.0% dilation strain at elevated temperatures. Vacancy jumps confine mostly to within the grain-boundary core. The jump direction is preferentially along the tilt axis. The simulations have yielded, as functions of strain, reasonable values of vacancy formation and migration energies. The relation between diffusivity and atomic mean-square displacement has also been examined and used to calculate grain-boundary diffusivity.

Paper Details

Date Published: 21 May 1993
PDF: 8 pages
Proc. SPIE 1805, Submicrometer Metallization: Challenges, Opportunities, and Limitations, (21 May 1993); doi: 10.1117/12.145451
Show Author Affiliations
Thomas Kwok, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 1805:
Submicrometer Metallization: Challenges, Opportunities, and Limitations
Thomas Kwok; Takamaro Kikkawa; Krishna Shenai, Editor(s)

© SPIE. Terms of Use
Back to Top