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Proceedings Paper

Specifications for the development of a 3D visual inspection/diagnosis system for damaged VLSI boards: VLSI reverse engineering
Author(s): Ali Moghaddamzadeh; Nikolaos G. Bourbakis
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Paper Abstract

The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new "frame" for the achievement of better results regarding efficiency, quality and automated service. Thus, the development of a knowledge base for automated inspection and acquisition of VLSI boards becomes an important issue with today's needs from the electronic marketing. Inthis paper we describe the visual inspection of damaged VLSI boards and discuss the specifications for the development of a knowledge base associated with the visual inspection.

Paper Details

Date Published: 6 May 1993
PDF: 9 pages
Proc. SPIE 1907, Machine Vision Applications in Industrial Inspection, (6 May 1993); doi: 10.1117/12.144801
Show Author Affiliations
Ali Moghaddamzadeh, SUNY/Binghamton (United States)
Nikolaos G. Bourbakis, SUNY/Binghamton (United States)


Published in SPIE Proceedings Vol. 1907:
Machine Vision Applications in Industrial Inspection
Frederick Y. Wu; Benjamin M. Dawson, Editor(s)

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