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Proceedings Paper

Profile characteristics of excimer laser micromachined features
Author(s): Martin D. Tabat; Terence R. O'Keeffe; Wen Ho
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Paper Abstract

In our work with excimer lasers, we observe a complex depth profile in processed blind holes that is energy, material, and process independent. This feature occurs when processing ceramics, polyimide, semiconductors, and metals. Further it occurs under different optical configurations. An understanding of this phenomena is essential when micron-precision features are required. We present our findings and explore explanations.

Paper Details

Date Published: 19 April 1993
PDF: 14 pages
Proc. SPIE 1835, Excimer Lasers: Applications, Beam Delivery Systems, and Laser Design, (19 April 1993); doi: 10.1117/12.143039
Show Author Affiliations
Martin D. Tabat, Resonetics, Inc. (United States)
Terence R. O'Keeffe, Resonetics, Inc. (United States)
Wen Ho, Resonetics, Inc. (United States)

Published in SPIE Proceedings Vol. 1835:
Excimer Lasers: Applications, Beam Delivery Systems, and Laser Design
James A. Greer, Editor(s)

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