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Proceedings Paper

Application-specific resist stripping with integrated processing in a single multiple-process chamber
Author(s): Richard L. Bersin
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Paper Abstract

A multi-process chamber has been developed for ashing of photoresist. Using microwave downstream and RIE processing, ashing processes have been developed which result in residues soluble in DI water, bypassing the need for solvent or acid treatment.

Paper Details

Date Published: 16 April 1993
PDF: 6 pages
Proc. SPIE 1803, Advanced Techniques for Integrated Circuit Processing II, (16 April 1993); doi: 10.1117/12.142930
Show Author Affiliations
Richard L. Bersin, ULVAC Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 1803:
Advanced Techniques for Integrated Circuit Processing II
James A. Bondur; Gary Castleman; Lloyd R. Harriott; Terry R. Turner, Editor(s)

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