Share Email Print
cover

Proceedings Paper

Process control improvements realized in a vertical reactor cluster tool
Author(s): Chris J. Werkhoven; E. H. Granneman; E. Lindow
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Advance cell structures present in high-density memories and logic devices require high quality, ultra thin dielectric and conductor films. By controlling the interface properties of such films, remarkable process control enhancements of manufacturing proven, vertical LPCVD and oxidation processes are realized. To this end, an HF/H2O vapor etch reactor is integrated in a vacuum cluster tool comprising vertical reactors for the various LPCVD and oxidation processes. Data of process control improvement are provided for polysilicon emitters, polysilicon contacts, polysilicon gates, and NO capacitors. Finally, the cost of ownership of cluster tool use is compared with that of stand-along equipment.

Paper Details

Date Published: 16 April 1993
PDF: 13 pages
Proc. SPIE 1803, Advanced Techniques for Integrated Circuit Processing II, (16 April 1993); doi: 10.1117/12.142928
Show Author Affiliations
Chris J. Werkhoven, ASM International N.V. (Netherlands)
E. H. Granneman, ASM International N.V. (Netherlands)
E. Lindow, ASM International N.V. (Netherlands)


Published in SPIE Proceedings Vol. 1803:
Advanced Techniques for Integrated Circuit Processing II
James A. Bondur; Gary Castleman; Lloyd R. Harriott; Terry R. Turner, Editor(s)

© SPIE. Terms of Use
Back to Top