Share Email Print

Proceedings Paper

Closed-loop temperature control system for a low-temperature etch chuck
Author(s): D. Rex Wright; Wayne D. Clark; Dennis C. Hartman; U. C. Sridharan; Martin Kent; Ralph C. Kerns
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A closed-loop temperature control system has been developed for use in a low-temperature (-135 degree(s)C) plasma etch system. The system employs an optical fluorescence probe on the chuck (a second probe monitors the wafer temperature as well) to provide feedback to the heating element on the input line of the chuck closed-loop coolant fluid. A simple proportional-integral-derivative (PID) controller with a learn mode controls the rate of current pulses applied to the heater. Innovations include the direct measurement of chuck temperature for the control signal, and the coupling of large cooling and heating capacities in close proximity to the chuck along with a fast fluid flow to guarantee quick response. The system has been tested in prolonged etch runs of many wafers. It provides reliable, tight temperature control (3(sigma) as low as 0.6 degree(s)C). This level of control is significantly tighter than could be achieved by merely monitoring chiller bath temperatures.

Paper Details

Date Published: 16 April 1993
PDF: 9 pages
Proc. SPIE 1803, Advanced Techniques for Integrated Circuit Processing II, (16 April 1993); doi: 10.1117/12.142927
Show Author Affiliations
D. Rex Wright, SEMATECH (United States)
Wayne D. Clark, SEMATECH (United States)
Dennis C. Hartman, SEMATECH (United States)
U. C. Sridharan, SEMATECH (United States)
Martin Kent, Drytek Inc. (United States)
Ralph C. Kerns, Drytek Inc. (United States)

Published in SPIE Proceedings Vol. 1803:
Advanced Techniques for Integrated Circuit Processing II
James A. Bondur; Gary Castleman; Lloyd R. Harriott; Terry R. Turner, Editor(s)

© SPIE. Terms of Use
Back to Top