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Proceedings Paper

New role of high-sensitivity database inspection
Author(s): Rosanne LaVoy
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Paper Abstract

In the past, database inspection of photo masks has been used primarily as design verification; defect inspection was done only as a last resort. The increase of single die reticles has forced increasing use of database for defect inspection, but at the cost of sensitivity and through put time (TPT). With the advent of fast throughput and high sensitivity database systems, the use of database for inspection of photo masks is taking on a new role. The comparison of chrome on glass photo masks to the ideal database can now be used to quantify mask parameters such as process bias uniformity, edge roughness, and transmission uniformity in addition to defects. Database inspection will move from the realm of a last resort option to a preferred option. The user must now be prepared to understand and use the valuable data now available to them to quantify the quality of their mask, and improve their process. Intel designed artifact masks were created to quantify process bias uniformity in addition to other defects. Using mask to database inspection, critical dimension (CD) process uniformity, and edge roughness in addition to both traditional and thoroughness defects, were quantified throughout the active area. Results presented demonstrate the additional information now available to the mask engineer to evaluate mask quality, and implement process changes.

Paper Details

Date Published: 26 March 1993
PDF: 7 pages
Proc. SPIE 1809, 12th Annual BACUS Symposium on Photomask Technology and Management, (26 March 1993); doi: 10.1117/12.142139
Show Author Affiliations
Rosanne LaVoy, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 1809:
12th Annual BACUS Symposium on Photomask Technology and Management
Scott Landstrom; Richard LaFrance, Editor(s)

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