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Proceedings Paper

Laser processing for multichip module customization
Author(s): Robert F. Miracky; Seyed Hassan Hashemi; Tom J. Hirsch; Heinrich G. Mueller; Tom Rudwick; Scott C. Sommerfeldt; William Weigler
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Paper Abstract

We have applied laser direct-write processing techniques to the fabrication of 'multi-chip modules' (MCMs), a next-generation advanced semiconductor packaging technology. To minimize the amount of laser processing which is required, we have created new MCM designs which allow the formation of custom interconnects from generic wire segments solely by means of localized laser links and cuts. In a recent large scale demonstration, we successfully laser-customized a multi-chip modules by means of 3,970 links and 1,624 cuts. The multi-chip module functioned successfully when inserted into its test bed. Separate pulse propagation experiments on the passive substrate prior to assembly demonstrated that such laser-formed interconnects have performance virtually indistinguishable from conventionally patterned ones.

Paper Details

Date Published: 16 March 1993
PDF: 6 pages
Proc. SPIE 1804, Rapid Thermal and Laser Processing, (16 March 1993); doi: 10.1117/12.142087
Show Author Affiliations
Robert F. Miracky, Microelectronics and Computer Technology Corp. (United States)
Seyed Hassan Hashemi, Microelectronics and Computer Technology Corp. (United States)
Tom J. Hirsch, Microelectronics and Computer Technology Corp. (United States)
Heinrich G. Mueller, Microelectronics and Computer Technology Corp. (United States)
Tom Rudwick, Microelectronics and Computer Technology Corp. (United States)
Scott C. Sommerfeldt, Microelectronics and Computer Technology Corp. (United States)
William Weigler, Microelectronics and Computer Technology Corp. (United States)


Published in SPIE Proceedings Vol. 1804:
Rapid Thermal and Laser Processing
Dim-Lee Kwong; Heinrich G. Mueller, Editor(s)

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