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Proceedings Paper

RTP temperature control requirement for submicron device fabrication
Author(s): Asit K. Ray
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Paper Abstract

For deep submicron device manufacturing, Rapid Thermal Processing (RTP) tools will play a major role. Current RTP tools have not been fully integrated into manufacturing. The most important problem is the product wafer temperature control. Data obtained on implant activation, titanium silicidation and oxidation processes will be reviewed to present the capability of current tools. Temperature control requirements for deep submicron device manufacturing will be discussed. Process performance of current RTP tools fall far short of the requirements.

Paper Details

Date Published: 16 March 1993
PDF: 11 pages
Proc. SPIE 1804, Rapid Thermal and Laser Processing, (16 March 1993); doi: 10.1117/12.142078
Show Author Affiliations
Asit K. Ray, SEMATECH (United States)


Published in SPIE Proceedings Vol. 1804:
Rapid Thermal and Laser Processing
Dim-Lee Kwong; Heinrich G. Mueller, Editor(s)

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